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mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 1 of 14 sept - 2014 rev. 00 1 product preview features and benefits ? 2 high power independent drivers (2 .5 ap eak in square and 1apeak in sine mode ) ? full bridge drive capabilities ? built - in protection features (antenna fault detection, over current and t ) for guaranteed safe operation in all conditions ? easy - to - use through spi interface ? built - in ask and fsk immobilizers application examples ? passive start system ? tpms initiator ? lf door opener ? active rfid initiator ordering information part code temperature code package code option code packing form co de mlx74190 r ( - 40c to 105c) pf (lead free tqfp 7x7 48 leads) aba - 000 re this document is a product preview, to get access to the full datasheet and related documentations , please directly contact melexis at sales_europe@melexis.com or sales_usa@melexis.com . description the mlx74190 low - frequency (lf) initiator ic consists in two high power lf drivers and built - in immobilizers (immo). the main a pplication for the mlx74190 is a u tomotive remote passive s tart, where the ic transmits a high power lf telegram to wake - up the key inside the car. the key sends out its identification number to the car via an ultra - high frequency (uhf) signal, enabling the engine to start. the mlx74190 al so features two built - in immobilizers (for ask and fsk communications), used when the battery of the key is depleted. in this case, the key is placed in a specific zone close to the initiator and a full passive rfid communication is initiated. the load mod ulation signal returns by the key is received and demodulated by the mlx74190. the mlx74190 can also serve for a similar purpose with other vehicles such as; motorcycles, scooters, all - terrain vehicle (atv), jet skis, snowmobiles and motorboats, where the key holder can be detected when approaching the engine and will be able to activate it from a start button, or as a dead man switch so that if the driver falls off then the engine is automatically cut. in addition it may be incorporated into building access systems, tire pressure monitoring system (tpms) initiators and pet identification system. both lf drivers are independently programmable to generate sine (max. 1ap) or square (max. 2.5ap) waves, with a frequency from 109khz to 140khz and an output a mplitude from 0.25 to 32vpp. the two drivers can be used in full or half bridge configuration and are protected against overload (over - current and over - temperature). a built - in diagnosis function allows detecting any wrong connection with the lf antenna (s hort to gnd, short to vbat, open load or wrong resonance frequency). the mlx74190 is supplied by an external vs voltage from 6 - 40v and vdd voltage of typically 5v. the vs voltage can be generated by an external dc - dc converter or by dc voltage from vehicl e supply. the mlx74190 is controlled through a standard spi interface (sdi, sdo, sck and ncs) and an interrupt pin is generated on - purpose by the ic. the mlx74190 is clocked either with a 2 mhz clock frequency signal coming from the mcu or by an on - chip oscillator connected to an external 4 mhz crystal or ceramic resonator. figure 1 : passive start application
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 2 of 14 sept - 201 4 rev. 001 product preview table of contents 1 absolute maximum ratings ................................ ................................ ................................ .............................. 3 2 range of fun ctionality ................................ ................................ ................................ ................................ ...... 3 1 pin out description ................................ ................................ ................................ ................................ ............ 4 2 high level block diagram ................................ ................................ ................................ ................................ 6 3 operating modes ................................ ................................ ................................ ................................ .............. 7 3.1 sleep mode ................................ ................................ ................................ ................................ ................ 7 3.2 standby mode ................................ ................................ ................................ ................................ ............ 7 3.3 transmis sion mode ................................ ................................ ................................ ................................ ... 7 3.4 diagnosis mode ................................ ................................ ................................ ................................ ......... 7 4 device description ................................ ................................ ................................ ................................ ........... 8 4.1 power s upplies, internal regulation and references ................................ ................................ .................. 8 4.2 system clock ................................ ................................ ................................ ................................ .............. 8 4.3 low frequency generation ................................ ................................ ................................ ....................... 8 4.4 sine wave generation ................................ ................................ ................................ ................................ 8 4.5 square wave generation ................................ ................................ ................................ ............................ 8 4.6 modulator ................................ ................................ ................................ ................................ ................... 8 4.7 immobilizer ask ................................ ................................ ................................ ................................ ........ 8 4.8 immobilizer fsk ................................ ................................ ................................ ................................ ........ 9 4.9 digital spi interface ................................ ................................ ................................ ................................ ... 9 4.10 spi commands ................................ ................................ ................................ ................................ ........ 9 4.11 failure flags ................................ ................................ ................................ ................................ ............ 9 4.12 antenna diagnosis ................................ ................................ ................................ ................................ ... 9 4.13 current measurement ................................ ................................ ................................ .............................. 9 5 application information ................................ ................................ ................................ ................................ ... 10 1 package and marking information ................................ ................................ ................................ .................. 11 1.1 package data tqfp ep 48l (7x7, 48 leads) ................................ ................................ ........................... 11 1.2 marking instruction ................................ ................................ ................................ ................................ ... 12 2 standard information regarding manufacturability of melexis products with different soldering processes .. 13 3 disclaimer ................................ ................................ ................................ ................................ ....................... 14 4 contact information ................................ ................................ ................................ ................................ ........ 14
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 3 of 14 sept - 201 4 rev. 001 product preview 1 absolute maximum r atings parameter symbol min max units comment driver supply voltage vs 45 v 5v supply vdd 7 v storage temperature range t s - 55 150 ? c junction temperature tj - 40 165 ? c static thermal resistance from junction to ambient rthja 28 k/w esd sensitivity (hbm global pins) v esdglobal +/ - 3 kv out1, out2, vs, ask_rxi, fsk_rxi esd sensitivity (hbm local pins) v esdlocal +/ - 2 kv all other pins esd sensitivity (cdm) v cdm_sens (hbm global pins) +/ - 500 v table 1 : absolute maximum ratings exceeding the absolute maximum ratings may cause permanent damage. exposure to absolute - maximum - rated conditions for extended periods may affect device reli ability. 2 range of functionality parameter symbol min value typical max value units 5v supply vdd 4.5 5 5.5 v driver supply voltage C operating vs 6 - 40 v input voltage range on pins: ncs, sclk, sdi, wup, clk_in and remote_data_in, osc vin_dig - 0.5 vdd 5.5 v operating temperature range t a - 40 - 105 ? c table 2 : range of functionality note: every electrical parameter specified in this document, except if specifically indicated, is valid in the complete temperature range: - 40 / 1 05 ? c .
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 4 of 14 sept - 201 4 rev. 001 product preview 1 pin out description pin name type function 1 fsk_rx2 analog fsk immobilizer input pin 2 2 fsk_fb2 analog fsk immobilizer feedback loop 2 3 ip_sense analog current measurement output voltage 4 rbias analog reference resistor connection for trimming the current reference 5 ext_clk digital external clock used in combination with clk_in to connect an external resonator 6 clk_in digital input clock coming from mcu or connected to external resonator 7 osc analog 125khz clock input/output 8 out1 analog antenna connection (d river output 1) 9 gnd ground power ground for driver outputs 10 vs supply supply for driver outputs 11 out2 analog antenna connection (driver output 2) 12 clk_out digital 2mhz clock output 13 wup digital wake up pin 15 sclk digital serial clock for spi 16 ncs digital not chip select for spi 17 sdo digital slave data output for spi 18 sdi digital slave data input for spi 19 irq digital interrupt signal output 20 d_out digital immobilizer data / digital modulation output signal 21 rdi digital inp ut signal for direct lf modulation (rdi = remote_data_in) 22 vdda_cap supply analog internal regulator decoupling cap. 23 ask_rx1 analog ask immobilizer input 1 24 ask_rx2 analog ask immobilizer input 2 25 agnd ground analog ground 36 vdd supply 5v su pply 38 dgnd ground digital ground 41 vddd_cap supply digital internal regulator decoupling capacitor 47 fsk_rx1 analog fsk immobilizer input pin 1 48 fsk_fb1 analog fsk immobilizer feedback loop 1 14, 46 reserved na must be externally connected to g round 26,27,28,29,30, 31,32, 33, 34, 35, 37,39, 40, 42, 43, 44, 45 nc na not connected exp exp ground exposed pad, to be connected to ground table 3 : pin out description
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 5 of 14 sept - 201 4 rev. 001 product preview table 4 : top view of the package tqfp48 d g n d d _ o u t 1 2 3 4 5 6 a g n d 7 n . c . 8 n c s s d o s d i 1 5 f s k _ r x 2 1 6 f s k _ f b 2 1 7 r b i a s 1 8 e x t _ c l k 1 9 c l k _ i n 2 0 n . c . n . c . n . c . n . c . v s g n d o u t 1 o s c r d i n . c . n . c . n . c . f s k _ r x 1 n . c . v d d m l x 7 4 1 9 0 z z z z z z z z z y y w w n . c . n . c . n . c . n . c . o u t 2 9 1 0 1 1 1 2 2 2 2 3 2 4 2 1 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 3 9 3 8 3 7 4 0 1 3 1 4 c l k _ o u t i p _ s e n s e w u p n . c . s c l k i r q v d d a _ c a p a s k _ r x 1 a s k _ r x 2 n . c . n . c . n . c . n . c . v d d d _ c a p n . c . f s k _ f b 1
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 6 of 14 sept - 201 4 rev. 001 product preview 2 high level block diagram figure 2 : mlx 7 4190 high level block diagram m l x 7 4 1 9 0 v d d p r e - r e g u l a t o r + h i g h - a c c u r a c y b a n d - g a p a n a l o g r e g u l a t o r b i a s c u r r e n t r e f e r e n c e s , a u t o m a t i c t r i m m i n g d i g i t a l r e g u l a t o r p o r v d d a d r i v e r a c - c u r r e n t p e a k d e t e c t o r c l k _ 3 2 m h z o u t 1 o u t 2 i p _ s e n s e o u t p u t o f l i n e - c o d i n g s t a t e m a c h i n e r s s i r e m o t e _ d a t a _ i n c l k _ 2 m h z c l k _ i n e x t _ c l k c l k _ o u t v d d d _ c a p d _ o u t s c l k s d i s d o n c s i r q g n d v s v d d a _ c a p a g n d d g n d r e m o t e _ d a t a _ i n w u p v d d d a s k _ a d c o u t v d d m o n i t o r i n g t e m p e r a t u r e m o n i t o r i n g s p i r e g i s t e r s f s m c o n t r o l l e r p l l x 1 6 d i g i t a l m o d u l a t i o n s i g n a l s i n u s d a c p g a v o l t a g e r e f e r e n c e s f i l t e r p h a s e s i n u s d a c p g a f i l t e r p h a s e c o u n t e r t e s t & n a n d t r e e t r a n s m i s s i o n m o d u l a t o r m o d u l a t o r s t a r t / s t o p i m m o - f s k m o d _ i n d i g i t a l _ m o d u l a t i o n v o l t a g e r e f e r e n c e s m o d u l + p h a s e m o d u l + p h a s e r b i a s o v t t p w p o r b p o r b v d d _ u v a s k _ r x 2 a s k _ r x 1 i n p u t s t a g e f i l t e r a d c c l o c k d i v i d e r a s k _ i n s e l a s k _ i n r g [ 1 : 0 ] a s k _ a d c r e a d y a s k _ a d c s t a r t a s k / f s k i m m o b i l i z e r c l k _ o s c r b i a s p g a _ i n _ s q u a r e d u t y c y c l e c o n t r o l l e r d r i v e r i _ o u t 1 i _ o u t 2 i _ o u t 2 i _ o u t 1 g n d v s f s k _ f b 1 f s k _ r x 1 f s k _ f b 2 f s k _ r x 2 v s r b i a s o v e r c u r r e n t p r o t e c t i o n o v e r c f l a g i m m o d e m o d o u t d i a g n o s i s f l a g v s _ u v s y s t e m c l o c k p o w e r s u p p l i e s , i n t e r n a l r e g u l a t i o n a n d r e f e r e n c e s v s m o n i t o r i n g b a n d - p a s s f i l t e r f s k _ d a t a o u t d a t a s l i c e r f s k _ i n s e l f s k _ e n f s k / a s k i m m o b i l i z e r s a s k _ e n i m m o b i l i z e r s i g n a l g e n e r a t o r d i a g n o s i s f s k _ d a t a o u t a s k _ a d c o u t l f t r a n s m i s s i o n c h a i n i _ o u t 2 i _ o u t 1 d i g i t a l c o n t r o l b l o c k s d i a g n o s i s v d d i m m o d e m o d o u t o s c m a s t e r / s l a v e
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 7 of 14 sept - 201 4 rev. 001 product preview 3 operating modes figure 3 : ml x 7 4190 operating modes transition diagram 3.1 sleep mode in sleep mode, a ll internal registers a re set to their default values, f lags and pointer are reset. all antenna outputs are switched to hi - z mode, the pll is switched off and the spi interface is deactiv ated. the device exits sleep mode when a rising edge is applied on the pin wup by the external host mcu. 3.2 standby mode in standby mode, a ll antenna outputs are switched to hi - z mode, all digital outputs are s witched to their default values and the internal lf transmission chain is deactivated. the spi interface is activated and the mlx74190 device is able to receive and answer spi command s from the external host mcu. 3.3 transmission mode in transmission mode, the mlx74190 is busy transmitting lf sequence (s) . al l digital outputs are active; the lf driver outputs are configured according to the configuration register active. the spi interface is activated and the mlx74190 device is able to receive and answer spi command s from the external host mcu. 3.4 diagnosis mode in diagnosis mode, the mlx74190 is busy with diagnosis procedure. all digital outputs are set in default states; the lf driver outputs are activated and ready for diagnosis process. the spi interface is activated and the mlx74190 device is able to receive spi command from the external host mcu. s l e e p r i s i n g e d g e o n w u p a c t i v e s u p p l y o f f s t a r t t i m e - o u t ( s p i o r p r g ) o r c o m m a n d g o t o s l e e p o r v d d < v d d _ u v t h o r f a l l i n g e d g e o n w u p e n d o f t r a n s m i s s i o n o r c o m m a n d g o t o s t a n d b y o r o v e r - t e m p e r a t u r e o r v s < v s _ u v t h o r t r a n s m i s s i o n a b o r t e d r e a d y t o t r a n s m i t d i r e c t c o m m a n d t r i g g e r d i a g n o s i s e n d o f d i a g n o s i s o r c o m m a n d g o t o s t a n d b y o r o v e r - t e m p e r a t u r e o r v s < v s _ u v t h t r a n s m i s s i o n s t a y s i n t h e l o o p i f s p i c o m m a n d r e c e i v e d s t a n d - b y s t a y s i n t h e l o o p i f s p i c o m m a n d r e c e i v e d d i a g n o s i s s t a y s i n t h e l o o p i f s p i c o m m a n d r e c e i v e d v d d > ( v d d _ u v t h + v d d _ u v _ h y s ) f r o m a n y s t a t e t i m e - o u t ( s p i o r p r g ) o r c o m m a n d g o t o s l e e p o r v d d < v d d _ u v t h o r f a l l i n g e d g e o n w u p o r p l l u n l o c k
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 8 of 14 sept - 201 4 rev. 001 product preview 4 de vice description 4.1 power supplies, internal r egulation and references the mlx74190 is supplied with vdd voltage of typically +5 v and vs voltage between 6 to 40 v, used for the embedded drivers. both voltages are inte rnally monitored and the mlx74190 device enters the corresponding under - voltage conditions if vdd or vs is going below the vdd_uv or vs _uv thresholds . 4.2 system clock the 32mhz i nternal system clock frequency is generated either from an external 2mhz clock si gnal provided by an external device (usually coming from a microcontroller) or by using an external crystal resonator whose frequency value is 4 m hz. the recognition of the input clock source is done automatically during the start - up phase . 4.3 low frequency g e neration the frequency generated by the lf driver can be set to a fix ed value of 125 khz or to a programmable value , from 110 khz up to 141.6 khz . 4.4 sine wave generatio n in this mode, the generated output is a pure sinus signal , with a dc voltage value of v s/2 and a frequency set according to the frequency generation value s describe d above. the output voltage can also be adjusted from 0.25vpp up to 32vpp . 4.5 square wave generation in this mode, the generated output is a square wave signal with amplitude fixed to the rail - to - rail value of the driver supply voltage vs . the duty - cycle of the square wave signal can be configured to 4 values between 6.25% up to 50% . 4.6 modulator each driver stage is able to modulate the lf carrier signal in ask and psk mode : ? ask : th e amplitude of the carrier frequency is modulated from 0 to 100% ? psk: t he phase of the carrier frequency on the output switches between 0 and 180 4.7 immobilizer ask the ask demodulator converts the amplitude - modulated analog signal received on ask_rxi pin s from the transpo nder into digital data which are accessible by the mcu through the d_out output pin. the data - rate can be adjusted to 2kbps, 4kbps or 8kbps. the ask_rxi inputs are connected to the lf antenna through an external capacitive divider whose value will depend on the antenna quality factor. the capacitive divider should be carefully calculated to avoid entering into the clamping region which would strongly decrease the overall sensitivity.
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 9 of 14 sept - 201 4 rev. 001 product preview 4.8 immobilizer fsk the fsk demodulation block is intende d to detect and demodulate the response of the transponder compliant with fsk modulation (frequency shift keying). the d emodula ted data are accessible by the m c u through the d_out output pin. the fsk signal is a modulated frequency signal, where high and l ow bits are coded with two different frequencies. the fsk_rxi inputs are connected to the lf antenna through external resistors rin and rfb , which must be adjusted according to the voltage swing on the external antenna. 4.9 digital spi interface the mlx74190 is interfaced and configured through a standard serial peripheral interface bus ( s pi) . the communication is full duplex , the host mcu always act s as a master and the mlx74190 alwa ys act s as a s la ve. ? ncs: non chip select ? sclk: serial clock ? sdi: serial data in ? sdo serial data out 4.10 spi commands the mlx74190 is controlled through a set of spi commands sent by the host mcu. these spi commands are used to configure the int ernal registers of the mlx74190 . 4.11 failure flags the following failures / warnings are detected by the mlx74190: ? vs /vdd under voltage ? temperature monitoring ( pre - warning & o ver temperature ) ? antenna over c urrent ? spi - error s 4.12 antenna diagnosis the diagnosis block is designed to detect any failure related to the antenna connected on the lf driver output s . following potential antenna failures are diagnosed: ? antenna s hort circuit ed to vs /gnd ? disconnected antenna or i ncorrect self resonance frequency 4.13 current measurement the cur rent measurement block allows monitoring on time the ac current flowing through the selected output antenna d river. the analog voltage corresponding to the measured current is available on the pin ip_sense.
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 10 of 14 sept - 201 4 rev. 001 product preview 5 application information typical application sc hematic is shown below: figure 4 : typical application schematic passive start o u t 1 r s 1 c s 1 l f 1 s c l k s d i s d o n c s i r q w u p s c l k s d i s d o n c s i r q w u p r b i a s a g n d d g n d i p _ s e n s m c u ( a / d ) g n d a s k _ r x ( i m m o ) m l x 7 4 1 9 0 c l k _ i n 2 m h z ( o p t . ) v s r e m o t e d a t a ( o p t ) r e m o t e _ d a t a _ i n c l k _ i n e x t _ c l k o u t 2 r s 2 c s 2 l f 2 f s k _ r x ( i m m o ) f s k _ f b 4 m h z c r y s t a l i s o p t i o n n a l v d d d _ c a p v d d a _ c a p v d d + 5 v c l k _ o u t o s c d o u t v s m c u
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 11 of 14 sept - 201 4 rev. 001 product preview 1 package and marking information 1.1 package data tqfp ep 48l (7x7, 48 leads) a a1 a2 b b1 d d1 d2 e e1 e2 e l n ccc ddd min - 0.05 0.95 0.17 0.17 9.00 7.00 4.00 9.00 7.00 4.00 0.50 0.45 48 - - nom - - 1.00 0.22 0.20 0.60 - - max 1.20 0.15 1.05 0.27 0.23 0.75 0.08 0.08 notes: 1. all dimensioning and tolerances conform to asme y14.5m - 1994, 2. datum plane [ - | - | - ] located at mould parting line and coincident with lead, where lead exists, plastic body at bottom of parting line. 3. datum [a - b] and [ - d - ] to be determined at centreline between leads where leads exist, plastic body at datum plane [ - | - | - ] 4. to be determined at seating plane [ - c - ] 5. dimensions d1 and e1 do not include mould protrusion. dimensions d1 and e1 do not include mould protrusion. allowable mou ld protrusion is 0.254 mm on d1 and e1 dimensions. 6. 'n' is the total number of terminals 7. these dimensions to be determined at datum plane [ - | - | - ] 8. package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 9. dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not be located on the lower radius of the foot. 10. controlling dimension millimetre. 11. maximum allowable die thickness to be assembled in this package family is 0.38mm 12. this outline conforms to jedec publication 95 registration ms - 026, variation aba, abc & abd. 13. a1 is defined as the distance from the seating plane to the lowest point of the package body. 14. dimension d2 and e2 repre sent the size of the exposed pad. the actual dimensions are specified ion the bonding diagram, and are independent from die s ize. 15. exposed pad shall be coplanar with bottom of package within 0.05. exposed pad need best possible contact to ground for exlectrical and thermal reasons
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 12 of 14 sept - 201 4 rev. 001 product preview 1.2 marking instruction f igure 5 : marking example on ic package tqfp ep 7x7 m l x 7 4 1 9 0 x z z z z z z z z z y y w w 1 l o t n u m b e r a s s e m b l y d a t e c o d e : w e e k n u m b e r a s s e m b l y d a t e c o d e : y e a r s i l i c o n r e v i s i o n : c h a r a c t e r [ a . . . z ]
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 13 of 14 sept - 201 4 rev. 001 product preview 2 standard information regarding manufacturability of melexis products with different soldering processe s our products are classified and qualified regarding solde ring technology, solderability and moisture sensitivity level according to following test methods: reflow soldering smds ( s urface m ount d evices) ? ipc/jedec j - std - 020 moisture/reflow sensitivity classification for nonhermetic solid state surface mount dev ices (classification reflow profiles according to table 5 - 2) ? eia/jedec jesd22 - a113 preconditioning of nonhermetic surface mount devices prior to reliability testing (reflow profiles according to table 2) wave soldering smds ( s urface m ount d evices) and t hds ( t hrough h ole d evices) ? en60749 - 20 resistance of plastic - encapsulated smds to combined effect of moisture and soldering heat ? eia/jedec jesd22 - b106 and en60749 - 15 resistance to soldering temperature for through - hole mounted devices iron soldering th ds ( t hrough h ole d evices) ? en60749 - 15 resistance to soldering temperature for through - hole mounted devices solder ability smds ( s urface m ount d evices) and thds ( t hrough h ole d evices) ? eia/jedec jesd22 - b102 and en60749 - 21 solderability for all solderin g technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc ) additional classification and qualification tests have to be agreed upon with melexis. the application of wave soldering for smds is allowed only after consulting melexis regarding assurance of adhesive strength between device and board. melexis recommends reviewing on our web site the general guidelines soldering recommendation ( http://www.melexis.com/quality_soldering.aspx ) as well as trim&form recommendati ons (http://www.melexis.com/assets/trim - and - form - recommendations - 5565.aspx). melexis is contributing to global environmental conservation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on the restriction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
mlx74190 two - fold high power lf initiator w ith integrated immobilizer 3901074190 01 page 14 of 14 sept - 201 4 rev. 001 product preview 3 disclaimer devices sold by melexis are cov ered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with melexis for current information. this product is intended for use in normal commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life - support or life - sustaining equipment are specific ally not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of melexis rendering of technical or other services. ? 2014 melexis nv . all rights reserved. 4 contact information for the latest version of this document, go to our website at: www.melexis.com or for additional information contact melexis direct: europe, africa, asia: america: phone: +32 1367 049 phone: +1 248 306 5400 e - mail: sales_europe@melexis.com e - mail: sales_usa@melexis.com iso/ts 16949 and iso14001 certified

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